High-precision semi-auto FC bonder 'CB-700 (Athlete FA model)'
Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.
The "CB-700 (Athlete FA model)" is an all-in-one FC bonder for R&D purposes. It features an advanced interactive MMIF interface that enhances operability. With high precision (±0.5μm [3σ]) and a wide load range (0.05 to 1000N) as its foundation, it accommodates various applications and broadly meets the needs of R&D. 【Features】 ■ Extremely low load capability and high precision bonding ■ Tool lift operation utilizing high precision Z-axis control ■ Capable of ultrasonic bonding with tool exchange ■ Suitable for process development *For more details, please refer to the PDF document or feel free to contact us.
- Company：日精 本社
- Price：50 million yen-100 million yen
